ʻO nā kinoea maʻemaʻe kiʻekiʻe (UHP) ke koko ola o ka ʻoihana semiconductor. ʻOiai ke koi ʻole ʻia nei a me ka hoʻopau ʻana i nā kaulahao hoʻolako honua e hoʻonui i ke kumukūʻai o ke kinoea ultra-high pressure, ke hoʻonui nei ka hoʻolālā semiconductor hou a me nā hana hana i ke kiʻekiʻe o ka pollution control e pono ai. No nā mea hana semiconductor, hiki ke hōʻoia i ka maʻemaʻe o ke kinoea UHP ʻoi aku ka nui ma mua o ka wā.

He mea koʻikoʻi loa nā kinoea Ultra High Purity (UHP) i ka hana semiconductor hou

ʻO kekahi o nā noi nui o ke kinoea UHP ʻo ka inertization: Hoʻohana ʻia ke kinoea UHP e hāʻawi i kahi ea pale e pili ana i nā ʻāpana semiconductor, no laila e pale aku ai iā lākou mai nā hopena ʻino o ka wai, oxygen a me nā mea haumia ʻē aʻe i ka lewa. Eia nō naʻe, ʻo ka inertization kekahi o nā hana like ʻole a ke kinoea e hana ai i ka ʻoihana semiconductor. Mai nā kinoea plasma mua a hiki i nā kinoea reactive i hoʻohana ʻia i ka etching a me ka annealing, hoʻohana ʻia nā kinoea kiʻekiʻe kiʻekiʻe no nā kumu like ʻole a he mea nui ia ma ke kaulahao lako semiconductor.

ʻO kekahi o nā kinoea "core" i ka ʻoihana semiconductornitrogen(hoʻohana ʻia e like me ka hoʻomaʻemaʻe maʻamau a me ke kinoea inert),argon(hoʻohana ʻia e like me ke kinoea plasma mua i ka etching a me ka waiho ʻana i nā hopena),helium(hoʻohana ʻia ma ke ʻano he kinoea inert me nā waiwai hoʻoili wela kūikawā) ahydrogen(hoʻokani i nā hana he nui i ka annealing, deposition, epitaxy a me ka hoʻomaʻemaʻe plasma).

E like me ka hoʻololi ʻana o ka ʻenehana semiconductor, ua hoʻohana ʻia nā kinoea i ke kaʻina hana. I kēia lā, hoʻohana nā mea kanu semiconductor i nā ʻano kinoea ākea, mai nā kinoea hanohano e like mekryptonaneoni nā ʻano mea hoʻoulu e like me ka nitrogen trifluoride (NF 3) a me ka tungsten hexafluoride (WF 6).

Ke ulu nei ka makemake no ka maʻemaʻe

Mai ka hoʻomaka ʻana o ka microchip pāʻoihana mua, ua ʻike ka honua i kahi piʻi kokoke kokoke i ka exponential i ka hana o nā mea semiconductor. I loko o nā makahiki ʻelima i hala iho nei, ʻo kekahi o nā ala ʻoi loa e hoʻokō ai i kēia ʻano o ka hoʻomaikaʻi ʻana i ka hana ma o ka "scaling size": e hōʻemi ana i nā kiʻi nui o nā hale kiʻi chip e kū nei i mea e kaomi ai i nā transistors hou aʻe i kahi ākea. Ma waho aʻe o kēia, ʻo ka hoʻomohala ʻana i nā hale kiʻi chip hou a me ka hoʻohana ʻana i nā mea ʻokiʻoki i hana i nā lele i ka hana ʻana o ka mīkini.

I kēia lā, liʻiliʻi loa nā ʻāpana koʻikoʻi o nā semiconductor ʻokiʻoki i kēia manawa ʻaʻole hiki ke hoʻonui ʻia ka nui o ka scaling i kahi ala kūpono e hoʻomaikaʻi ai i ka hana o ka hāmeʻa. Akā, ke ʻimi nei nā mea noiʻi semiconductor i nā hoʻonā ma ke ʻano o nā mea kākau moʻolelo a me nā hale kiʻi 3D chip.

ʻO nā makahiki he nui o ka hoʻolālā hou ʻole ʻana, ʻoi aku ka ikaika o nā mea semiconductor o kēia lā ma mua o nā microchips kahiko - akā ʻoi aku ka palupalu. ʻO ka hiki ʻana mai o ka ʻenehana hana wafer 300mm ua hoʻonui i ka pae o ka mana haumia e pono ai no ka hana semiconductor. ʻO ka hoʻohaumia liʻiliʻi i loko o kahi kaʻina hana hana (ʻoi aku ka kakaikahi a i ʻole ke kinoea inert) hiki ke alakaʻi i ka hemahema o nā mea hana pōʻino - no laila ʻoi aku ka nui o ka hoʻomaʻemaʻe kinoea i kēia manawa.

No kahi mea kanu hana semiconductor maʻamau, ʻo ke kinoea hoʻomaʻemaʻe ultra-kiʻekiʻe ke kumu kūʻai nui loa ma hope o ke silika ponoʻī. Manaʻo ʻia kēia mau kumukūʻai e piʻi aʻe i ka piʻi ʻana o ke koi no nā semiconductor i nā kiʻekiʻe kiʻekiʻe. ʻO nā hanana ma ʻEulopa ua hoʻopilikia hou i ka mākeke kinoea kūlohelohe ultra-high pressure. ʻO Ukraine kekahi o nā mea kūʻai aku nui loa o ka honuaneonhōʻailona; ʻO ka hoʻouka kaua ʻana o Rūsia, ʻo ia hoʻi, ke kaohi ʻia nei nā lako o ke kinoea laha. ʻO kēia ka mea i alakaʻi i ka hemahema a me nā kumukūʻai kiʻekiʻe o nā kinoea hanohano e like mekryptonaxenon.